Integrated cirucit package and method for fabrication thereof

ABSTRACT

The invention provides an integrated circuit package and method of fabrication thereof. The integrated circuit package comprises an integrated circuit chip having a photosensitive device thereon; a bonding pad formed on an upper surface of the integrated circuit chip and electrically connected to the photosensitive device, a barrier formed between the bonding pad and the photosensitive device; and a conductive layer formed on a sidewall of the integrated circuit chip and electrically connected to the bonding pad. The barrier layer blocks overflow of the adhesive layer into a region, on which the photosensitive device is formed, to improve yield for fabricating the integrated circuit package.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to integrated circuit packages, and moreparticularly to an integrated circuit package having high yield and amethod for fabricating the same.

2. Description of the Related Art

In integrated circuit device fabrication, an integrated circuitpackaging step is performed. The integrated circuit, in which thepackaging step is performed, can be used in a wide variety ofapplications, including computers, mobile phones and digital cameras.Yield of the integrated circuit package can affect performance of anintegrated circuit device.

FIGS. 1A-1D are cross-sections of a conventional integrated circuitpackage. As shown in FIGS. 1A-1B, a protective layer 8 is formed on acovering plate 4 prior to bonding. FIGS. 1C-1D show a protective layer 8formed on a covering plate 4 prior to bonding. In FIG. 1A, an integratedcircuit chip 2, which has photosensitive devices 12 formed thereon andelectrically connected to a bonding pad 6, is illustrated. A coveringplate 4 is then attached to the integrated circuit chip 2 by an adhesivelayer 10 to form a distance 14 between the covering plate 4 and theintegrated circuit chip 2. During bonding of the covering plate 4 to theintegrated circuit chip 2, the adhesive layer 10 overflows onto thephotosensitive devices 12, as shown in FIG. 1A. FIG. 1B is across-section of the integrated circuit package, in which the adhesivelayer 10 overflows onto the photosensitive devices 12 during bonding, inFIG. 1A. In FIG. 1B, the adhesive layer overflows onto thephotosensitive device 12, and covers a portion of the photosensitivedevices 12, so that sensitivity of the photosensitive devices 12 tolight from covering plate 4 and distance 14 becomes uniform, whichresults in failure of the integrated circuit package.

In FIG. 1C, an integrated circuit chip 2 having photosensitive device 12and a bonding pad 6 is provided. A protective layer 8 covers the bondingpad 6, which is electrically connected to the photosensitive devices 12.A covering plate 4 is subsequently attached to the integrated circuitchip 2 by an adhesive layer 10 to form a distance 14 therebetween. Asshown in FIG. 1C, during bonding, the adhesive layer 10 overflows ontothe photosensitive device 12 along a sidewall of the protective layer 8.FIG. 1D is a cross-section of an integrated circuit package, in whichthe adhesive layer 10 overflows onto the photosensitive devices 12during bonding in FIG. 1C. The adhesive layer 10 overflows onto thephotosensitive device 12 and covers a portion of photosensitive device12, so that yield for fabricating the integrated circuit package, asshown in FIG. 1D, is reduced. Accordingly, the problems described occurin conventional bonding.

Thus, an integrated circuit package and fabrication method thereof isneeded to eliminate the problems described and increase yield offabrication.

BRIEF SUMMARY OF INVENTION

Accordingly, the invention provides an integrated circuit package. Anexemplary embodiment of the integrated circuit package comprises anintegrated circuit chip having a photosensitive device thereon; abonding pad formed on an upper surface of the integrated circuit chipand electrically connected to the photosensitive device; a first barrierformed between the bonding pad and the photosensitive device; and aconductive layer formed on a sidewall of the integrated circuit chip andelectrically connected to the bonding pad. The integrated circuitpackage further comprises a second barrier layer between the bonding padand the first barrier layer.

The invention also provides a method for fabricating an integratedcircuit package. The method comprises providing an integrated circuitchip having a photosensitive device thereon; forming a bonding pad onthe integrated circuit chip, and electrically connected to thephotosensitive device; forming a first barrier between the bonding padand the photosensitive device; and forming a conductive layer on asidewall of the integrated circuit chip, and electrically connected tothe bonding pad.

The integrated circuit package has a barrier layer between the bondingpad and the photosensitive device. Thus, the barrier layer blocks anoverflow of an adhesive layer into the photosensitive device duringbonding. Furthermore, since the barrier layer is disposed between thebonding pad and photosensitive device, the position and amount of theadhesive layer is thus accurately controlled to reduced fabricationcost.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

The invention can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIGS. 1A-1D are cross-sections of a conventional integrated circuitpackage;

FIGS. 2A-2H are cross-sections of a method for fabricating an integratedcircuit package according to first embodiment of the invention;

FIGS. 3A-3B are cross-sections of a method for fabricating an integratedcircuit package according to second embodiment of the invention;

FIGS. 4A-4D are cross-sections of a method for fabricating an integratedcircuit package according to third embodiment of the invention; and

FIGS. 5A-5B are cross-sections of a method for fabricating an integratedcircuit package according to fourth embodiment of the invention.

DETAILED DESCRIPTION OF INVENTION

The following description is of the best-contemplated mode of carryingout the invention. This description is made for the purpose ofillustrating the general principles of the invention and should not betaken in a limiting sense. The scope of the invention is best determinedby reference to the appended claims.

FIGS. 2A-2H are cross-sections of a method for fabricating an integratedcircuit package according to a first embodiment of the invention. InFIG. 2A, an integrated circuit chip 102 having upper and low surfaces103, 105 is provided. A photosensitive device 104 is then formed on theupper surface 103 of the integrated circuit 102. A bonding pad issubsequently formed on the upper surface 103 and electrically connectedto the photosensitive device 104, as shown in FIG. 2A.

In an embodiment, the integrated circuit chip 102 may be aphotosensitive integrated circuit chip. Preferably, the bonding pad 106is a material such as copper, aluminum or any suitable conductivematerial. In some embodiments, a conductive layer is formed on theintegrated circuit chip 102 by, for example, sputtering or evaporatingfollowed by photolithography and etching to form the bonding pad 106. Itis appreciated that while divided bonding pads are shown in FIG. 2A, thebonding pad may also be a continuous layer.

In FIG. 2B, a barrier layer 108, also referred to as gate pattern, isthen formed on the upper surface 103 of the integrated circuit chip 102,and the barrier layer 108 is between the bonding pad 106 and thephotosensitive device 104. In an embodiment, an insulating layer (notshown) is formed on the integrated circuit chip 102 by coating followedby patterning the insulating layer by photolithography and etching toform the barrier layer 108. Preferably, the barrier layer 108 is amaterial such as polyimide, epoxy, polyester or any suitable insulatingmaterial.

In FIG. 2C, a first substrate 110, also referred to as a covering plate,is provided. A protective layer 112, referred to as a dam, issubsequently formed on the first substrate 110 to prevent oxidation. Inan embodiment, the first substrate 110 may be glass, quartz, opal,plastic or any suitable transparent material. Preferably, the protectivelayer 112 is polyimide, epoxy or suitable insulating material. As shownin FIG. 2C, an adhesive layer 114 is formed on the protective layer 112.Preferably, the adhesive layer 114 is an adhesive material containingepoxy.

In FIG. 2D, the first substrate 110 is attached to the upper surface ofthe integrated circuit chip 102 by the adhesive layer 114 to form adistance between the first substrate 110 and integrated circuit chip102. After bonding the first substrate 110 to the integrated circuitchip 102, the protective layer 112 covers the bonding pad 106 to preventoxidation. The barrier layer 108 is between the protective layer 112 andthe photosensitive device 104. Preferably, a distance between thebarrier layer 108 and the protective layer 112 is more than or equal to0.5 μm.

Note that because the barrier layer is disposed between the bonding pad106 and the photosensitive layer 104, the adhesive layer 114 is formedbetween the barrier layer 108 and the bonding pad 106, as shown in FIG.2D. Accordingly, when processing bonding, the barrier layer blocksadhesive layer overflow into a region on which the photosensitive deviceis formed, preventing failure of the integrated circuit package. Forexample, adhesive layer overflow into a portion of the photosensitivedevice can cause light sensitized by the photosensitive device to beuniform or the portion of the photosensitive device covered by theadhesive layer unable to sensitize light. Furthermore, since the barrierlayer is disposed between the bonding pad and photosensitive device, theposition and amount of the adhesive layer is thus accurately controlledto reduce fabrication cost.

After bonding, a polishing step may optionally be performed to thin theintegrated circuit chip 102, facilitating cutting of individual die. Inan embodiment, the integrated circuit chip has a thickness of betweenabout 10 μm and 250 μm after the polishing step, facilitating cutting ofindividual die.

In FIG. 2E, a portion of the integrated circuit chip 102 is removedalong a predetermined cutting line of the die by photolithography andetching to form an opening 118 for cutting individual die. The opening118 may expose the protective layer 114 and a lower surface of thebonding pad 106.

In one embodiment, the etching process may be dry etching using a gascomprising sulfur hexafluoride (SF₆), octafluorocyclobutane (C₄F₈) orany suitable gas. In some embodiments, the etching process may be wetetching comprising silicon etchant, for example a solution mixing 2.5%of hydrogen fluoride acid (HF), 50% of hydrogen nitrate acid (HNO3), 10%of acetic acid (CH3COOH) and 37.5% of water, for removing a portion ofthe integrated circuit chip 102 and exposing the bonding pad 106. Thesilicon etchant may also comprise potassium hydroxide (KOH).

As shown in FIG. 2E, a second substrate 122 is subsequently attached tothe lower surface 105 of the integrated circuit chip 102 by a sealant120. The sealant 120 is formed on the lower surface 105 of theintegrated circuit 102 and filled in the opening 118. In one embodiment,the sealant 120 such as epoxy, polyimide (PI) or suitable material isformed on the lower surface 105 of the integrated circuit 102 bycoating. The second substrate 122 may be a material similar to the firstsubstrate or a suitable opaque substrate. Furthermore, the secondsubstrate 122 may carry the integrated circuit chip 102, thus, thesecond substrate 122 may also be referred to as a carry plate.

FIG. 2F is a cross-section of the integrated circuit package in FIG. 2Erotated through 180°. In FIG. 2F, an insulating layer 124 is formed onthe second substrate 122. Thereafter, a notching step, also referred toas cutting step, is performed along the predetermined cutting line ofthe individual die by notching equipment to form a trench 126 and exposea sidewall of the bonding pad 106 and a surface of the first substrate110.

In some embodiments, the insulating layer 124 such as silicon oxide,silicon dioxide, silicon nitride, photoresist material or any suitabledielectric material, may be formed by, for example spin coating, spraycoating, or low pressure chemical vapor deposition (LPCVD), plasmaenhanced chemical vapor deposition (PECVD).

In FIG. 2F, a conductive layer 128 is formed on the insulating layer 124and extending to the trench 126 to electrically connect to the bondingpad 106. Preferably, the conductive layer 128 may be aluminum, copper,nickel or any suitable conductive material. In an embodiment, a metallayer is conformally formed on the insulting layer 124, in which themetal layer extends from the surface of the insulating layer 124 and thesidewall of the bonding pad 106 to the surface of the first substrate110, by sputtering, evaporating, electroplating or plasma enhancedchemical vapor deposition (PECVD). The metal layer is patterned bylithography and etching to form the conductive layer 128 and expose aportion of the insulating layer 124.

Note that the metal layer may be difficultly formed on the bottom of thetrench 126 since the bottom of the trench 126 is narrow. Thus,electroless-plating is optionally performed to form the conductive layer128 on the bottom of the trench 126 after forming the metal layer. It isappreciated that the conductive layer 128 is formed only byelectroless-plating without patterning the metal layer.

In FIG. 2G, a solder mask 130 is formed on the conductive layer 128 toexpose a portion of the conductive layer 128 which defines a position ofa solder ball 132 subsequently formed. The solder ball 132 is thenformed on the exposed conductive layer 128 to electrically connect theconductive layer 128. The solder mask 130 serves as a protective layer.

An individual die is then cut along the predetermined cutting linethereof by a cutter, after the described steps. Thus, fabrication of anintegrated circuit package 140, as shown in FIG. 2H, is complete. FIG.2H is a cross-section of the integrated circuit package in FIG. 2G cutand rotated through 180°. As the integrated circuit package 140 shown inFIG. 2H, a photosensitive device 104 and bonding pad 106 are formed onan integrated circuit chip 102, on which the bonding pad 106 iselectrically connected to the photosensitive device 104. A conductivelayer 128 is formed on a sidewall of the integrated circuit chip 102 andelectrically-connected to bonding pad 106 and solder ball 132.

In FIG. 2H, a first substrate 110 is correspondingly disposed over theintegrated circuit chip 102 and a distance 116 is formed therebetween.Note that the integrated circuit package 140 according to firstembodiment of the invention has a barrier layer 108 between the bondingpad 106 and the photosensitive device 106 to prevent adhesive layeroverflow into the photosensitive device 104 avoiding faults in packagefabrication.

FIGS. 3A-3B are cross-sections of a method for fabricating an integratedcircuit package according to second embodiment of the invention. In FIG.3A, an integrated circuit chip 202, on which a photosensitive device 204formed, is provided. A bonding pad 206 is then formed on the integratedcircuit chip 202 and electrically connected to the photosensitive device204. Thereafter, a first barrier layer 208 and a second barrier layer210, also referred to as gate pattern, are formed on the integratedcircuit chip 202, and between the bonding pad 206 and the photosensitivedevice 204. In an embodiment, a height of the second barrier layer 210is less than or equal to one of the first barrier layer 208. The secondbarrier layer 208 is between the first barrier layer 208 and the bondingpad 206. Preferably, a distance between the second barrier layer 210 anda protective layer 214 subsequently formed is more than or equal toabout 0.5 μm.

As shown in FIG. 3A, a first substrate 212, which has a protective layer214 and an adhesive layer 216 formed thereon, is provided. The firstsubstrate 212 is then attached to the integrated circuit chip 202 by theadhesive layer 216 to form a distance therebetween. After bonding, theprotective layer 214 covers the bonding pad 206 and the adhesive layer216 covers the second barrier layer 210.

After bonding is complete, a portion of the integrated circuit chip 202is removed to form an individual die. Thereafter, a second substrate 222is attached to a lower surface of the integrated circuit chip 202 by asealant 220. An insulating layer 224 is formed on a lower surface of thesecond substrate 212 followed by a notching step to expose the bondingpad 206. A conductive layer 226 is formed on a sidewall of the secondsubstrate 222 and extending to the bonding pad 206 to electricallyconnect to the bonding pad 206. A solder mask 228 is then formed on theconductive layer 226. A solder ball 230 is then formed on the conductivelayer 226. Finally, an individual die is cut along the predeterminedcutting line thereof by cutter to complete a fabrication of integratedcircuit package 232, as shown in FIG. 3B. Formation and material of thedescribed elements may be similar to first embodiment, thus, furtherdescription is not provided.

Note that the integrated circuit package according to the secondembodiment of the invention has first and second barrier layers betweenthe bonding pad and the photosensitive device. Thus, during bonding, theadhesive layer does not overflow onto a region, on which thephotosensitive device is formed, avoiding failure of the integratedcircuit package caused by the adhesive layer. Furthermore, overflow ofthe adhesive layer is effectively blocked by the first and secondbarrier layers. It is appreciated that protective layer in the first andsecond embodiments may also be formed on the integrated circuit chip andthe protective layer may be formed with the barrier layer in situ toreduce processes.

FIGS. 4A-4D, are cross-sections of a method for fabricating anintegrated circuit package according to a third embodiment of theinvention. In FIG. 4A, an integrated circuit chip 302 having aphotosensitive device 304 is provided. A bonding pad 306 is then formedon the integrated circuit chip 302 and electrically connected tophotosensitive device 304. As shown in FIG. 4A, a protective layer 308,also referred to as dam, covers the bonding pad 306 for protection. Anadhesive layer 310 is subsequently formed on the protective layer 308.Formation and material of the elements may be the same as firstembodiment, thus, further description is not provided.

FIG. 4B shows a first substrate 314, on which a barrier layer 314 isformed. Formation and material of the first substrate 312 and barrierlayer 314 are preferably similar to the first embodiment. The firstsubstrate 312 is bonded to the integrated circuit chip 302 by theadhesive layer 310 to form a distance 316 between the first substrate312 and integrated circuit chip 302, as shown in FIG. 4C.

In FIG. 4C, after bonding, the barrier layer 314 disposed on the firstsubstrate 302, is formed between the bonding pad 306 and photosensitive304 to block overflow of the adhesive layer 310 into the photosensitivedevice 304. In one embodiment, when bonding is performed, a distancebetween the barrier layer 314 and protective layer 308 is more than orequal to about 0.5 μm.

After bonding, the integrated circuit chip 302 is cut byphotolithography and etching to form an individual die. Thereafter, asecond substrate 320 is attached to a lower surface of the integratedcircuit chip 302 by a sealant 318. An insulating layer 322 is formed ona lower surface of the second substrate 320 followed by a notching step,also referred to as cutting step, to expose a sidewall of the bondingpad 306 and a surface of the first substrate 312. A conductive layer 324is subsequently formed on a sidewall of the integrated circuit chip 302and electrically connected to bonding pad 306. A solder mask 326 coversa portion of the conductive layer 324. Thereafter, a solder ball 328 isformed on the conductive layer 324. Finally, an individual die is cutalong the predetermined cutting line thereof by cutter to complete afabrication of integrated circuit package 330, as shown in FIG. 4D.Formation and material of the described elements may be the same asfirst embodiment, thus, further description is not provided.

Note that the integrated circuit package according to the thirdembodiment of the invention has the barrier layer disposed thereon.During bonding, the barrier layer is formed between the bonding pad andthe photosensitive device. Thus, overflow of the adhesive layer isblocked into the photosensitive device to avoid failure of theintegrated circuit package.

FIGS. 5A-5B are cross-sections of a method for fabricating an integratedcircuit package according to fourth embodiment of the invention. In FIG.5A, an integrated circuit chip 402 having a photosensitive device 404thereon is provided. A bonding pad 406, which is electrically connectedto the photosensitive device 404, is subsequently formed on theintegrated circuit chip 402. Thereafter, a protective layer 408 coversthe bonding pad 406 for protection and an adhesive layer 401 is formedthereon.

As shown in FIG. 5A, a first substrate 412 having a first barrier layer414 and a second barrier layer 416 thereon is bonded to the integratedcircuit chip 402 by the adhesive layer 410 to form a distance 418. Inone embodiment, the second barrier layer 416 has a height less than orequal to the first barrier layer 414. After bonding, the first andsecond barrier layers 414, 416 are between the bonding pad 406 and thephotosensitive device 418. Preferably, a distance between the secondbarrier layer 416 and the protective layer 408 is more than or equal to0.5 μm. Note that an adequate distance may be between the first andsecond barrier layers to hold the adhesive layer 410 therebetween.

After bonding, the integrated circuit chip 402 is cut byphotolithography and etching to form an individual die. Thereafter, asecond substrate 422 is attached to a lower surface of the integratedcircuit chip 402 by a sealant 420. An insulating layer 424 is thenformed on a lower surface of the second substrate 422 followed by anotching step, also referred to as cutting step, to expose a sidewall ofthe bonding pad 406 and a surface of the first substrate 412. Aconductive layer 426 is subsequently formed on a sidewall of the secondsubstrate 422 and extending to the surface of the first substrate 412 toelectrically connect to bonding pad 406. A solder mask 428 covers aportion of the conductive layer 426. Thereafter, a solder ball 430 isformed on the conductive layer 426. Finally, an individual die is cutalong the predetermined cutting line thereof by cutter to complete afabrication of integrated circuit package 432, as shown in FIG. 5B.Formation and material of the described elements may be the same asfirst embodiment, thus, further description is not provided.

Note that the integrated circuit package according to the fourthembodiment of the invention has the first and second barrier layersformed on the first substrate. After bonding, the first and secondbarrier layers are between the bonding pad and the photosensitivedevice. Thus, the adhesive layer does not overflow onto a region, onwhich the photosensitive device is formed, to avoid failure of theintegrated circuit package caused by the adhesive layer for increasingyield thereof. Furthermore, overflow of the adhesive layer iseffectively blocked by the first and second barrier layers in thisembodiment.

Note that the protective layer in third and fourth embodiments may alsobe formed on the first substrate and the protective layer may be formedwith the barrier layers in situ to reduce processes. The first andsecond barrier layers may also be formed on the first substrate andintegrated circuit chip, respectively to block overflow of the adhesivelayer. Although drawings of the described embodiments are illustrated incross-section, barrier layers may be a ring surrounding thephotosensitive device on the integrated circuit chip to limit theadhesive layer from spreading.

While the invention has been described by way of example and in terms ofpreferred embodiment, it is to be understood that the invention is notlimited thereto. To the contrary, it is intended to cover variousmodifications and similar arrangements (as would be apparent to thoseskilled in the art). Therefore, the scope of the appended claims shouldbe accorded the broadest interpretation so as to encompass all suchmodifications and similar arrangements.

1. An integrated circuit package, comprising: an integrated circuit chiphaving a photosensitive device thereon; a bonding pad formed on an uppersurface of the integrated circuit chip and electrically connected to thephotosensitive device; a first barrier formed between the bonding padand the photosensitive device; and a conductive layer formed on asidewall of the integrated circuit chip and electrically connected tothe bonding pad.
 2. The package as claimed in claim 1, furthercomprising a second barrier between the bonding pad and the firstbarrier.
 3. The package as claimed in claim 2, wherein the first barrierhas a height more than or equal to a height of the second barrier. 4.The package as claimed in claim 2, wherein the second barrier isdisposed on the integrated circuit chip.
 5. The package as claimed inclaim 2, wherein the second barrier is disposed on a substratecorrespondingly placed on the integrated circuit chip.
 6. The package asclaimed in claim 5, further comprising: a protective layer covering thebonding pad; and an adhesive layer formed between the protective layerand the first barrier, and binding the integrated circuit chip and thesubstrate.
 7. The package as claimed in claim 5, wherein a distance isformed between the substrate and the integrated circuit chip.
 8. Thepackage as claimed in claim 1, wherein the first barrier comprisespolyimide, epoxy, polyester.
 9. The package as claimed in claim 1,further comprising a solder mask formed on the conductive layer.
 10. Thepackage as claimed in claim 1, further comprising a solder ball formedon the conductive layer.
 11. A method for fabricating a integratedcircuit package, comprising: providing an integrated circuit chip havinga photosensitive device thereon; forming a bonding pad on the integratedcircuit chip, and electrically connected to the photosensitive device;forming a first barrier between the bonding pad and the photosensitivedevice; and forming a conductive layer on a sidewall of the integratedcircuit chip, and electrically connected to the bonding pad.
 12. Themethod as claimed in claim 11, wherein forming the first barrier betweenthe bonding pad and the photosensitive device comprises: providing asubstrate; disposing the first barrier on the substrate; and attachingthe substrate to the integrated circuit chip by an adhesive layer toform the first barrier between the bonding pad and the photosensitivedevice.
 13. The method as claimed in claim 12, further comprisingdisposing a second barrier on the substrate, wherein the second barrieris formed between the bonding pad and the first barrier by attaching thesubstrate to the integrated circuit chip.
 14. The method as claimed inclaim 12, further comprising disposing a second barrier on theintegrated circuit chip, wherein the second barrier is formed betweenthe bonding pad and the first barrier by attaching the substrate to theintegrated circuit chip.
 15. The method as claimed in claim 11, whereinthe first barrier is disposed on the integrated circuit chip.
 16. Themethod as claimed in claim 15, further comprising disposing a secondbarrier on the integrated circuit chip, wherein the second barrier isformed between the bonding pad and the first barrier by attaching thesubstrate to the integrated circuit chip.
 17. The method as claimed inclaim 1 1, further comprising covering a protective layer on the bondingpad.
 18. The method as claimed in claim 11, wherein forming theconductive layer comprises: removing a portion of the integrated circuitchip and the protective layer to form a trench and expose the bondingpad; and forming the conductive layer on a lower surface of theintegrated circuit chip and extending to a sidewall and bottom surfaceof the trench to electrically connected to the bonding pad.
 19. Themethod as claimed in claim 11, further comprising covering a solder maskon a portion of the conductive layer and forming an exposed conductivelayer.
 20. The method as claimed in claim 19, further comprising forminga solder ball on the exposed conductive layer.